Lee Chee Ping

Senior Director, Technologist & Technical Marketing

Lee Chee Ping is the Technical Director from Lam Research, focusing on the heterogeneous integration segment. He has more than 20 years of experience in semiconductor industry, of which 14 years are related to advanced packaging. He has led worldwide field process teams and worked closely with customers on various 2D/2.5D/3D technologies development and qualification. He also engages the microelectronics ecosystem from universities, fabless players, IDMs, OSATs to equipment & material suppliers on technical exchanges and collaborations. In view of his deep understanding of this segment, Chee Ping now oversees advanced packaging market analysis and technology trends mapping, along with technical marketing of Lam’s wafer & panel level equipment solutions. He is a regular speaker at various semiconductor advanced packaging conferences worldwide. Chee Ping received his M.Eng in Technology Management from the University of South Australia, as well as both M.Sc in Financial Engineering and B.Eng in Chemical Engineering from National University of Singapore.