56
Day
16
Hour
25
Min
19
Sec

NATIONAL E&E FORUM 2024

25 Nov 2024 | Hilton Kuala Lumpur

Semiconductor As A Catalyst For The Malaysia Economy

Monday, 25 November 2024,

Hilton Kuala Lumpur,

Sentral Ballroom A & B

The MSIA National E&E Forum 2024 is back and set to be a groundbreaking event for the semiconductor industry, bringing together experts, innovators, and enthusiasts from around the world. With a focus on cutting-edge technology and electronic components, this forum promises to be a hub for knowledge exchange and collaboration. Participants can expect engaging discussions, insightful presentations, and networking opportunities that will shape the future of the semiconductor field.

Program

8:00 AM

Registration

8:30 AM

Welcome by Emcee

8:35 AM

Introductory Speech
Ybhg Dato’ Seri Wong Siew Hai
President, Malaysia Semiconductor Industry Association (MSIA)

8:45 AM

Keynote Speech

Why is the National Semiconductor Strategy Important for E&E Industry

•

YB Liew Chin Tong
Deputy Minister, Ministry of Investment, Trade and Industry (MITI)

9:00 AM

Special Presentation by Gold Sponsor

9:10 AM

Signed MOU Exchange Ceremony

Collaboration on Malaysia's First Locally Developed and Manufactured Edge Al System

•

SkyeChip Sdn Bhd | Elliance Sdn Bhd | Kaltech Sdn Bhd | Estek Automation Sdn Bhd

9:30 AM

Networking Break

11:00 AM

IC Design:Strategies to move up the value chain - areas of opportunities & lessons of success & failures
The discussion will delve into strategies for advancing within the integrated circuit (IC) design industry, pinpointing growth opportunities, and sharing real-world insights from both successful and challenging experiences. Panelists will discuss the evolving landscape of IC design and provide valuable perspectives on how companies can enhance competitiveness and drive innovation on a global scale.

Moderator:

•

Dr. James Ong
Founder and MD of Artificial Intelligence International Institute (AIII) and Adjunct Professor, Singapore University of Technology and Design (SUTD) & AI Mega Centre

Panelists:

•

Catherine Lian
Vice President & Executive Technology Leader, IBM ASEAN

•

Sathvik Rao
Managing Director, Accenture Industry X

•

Dr. Andrew Lau
Director of Strategic Programs, Microsoft Malaysia

12:00 PM

Advanced Packaging: How AP will scale Moore's law & transform semiconductor manufacturing
In this forward-looking panel experts will examine how breakthroughs in advanced packaging are enabling the continued scaling of Moore’s Law. Panelists will discuss innovative packaging techniques that enhance performance and efficiency, as well as their impact on semiconductor manufacturing. Gain insights into how these advancements are reshaping the production landscape, supporting the demand for powerful, compact technologies, and driving new possibilities for the future of the industry.

Moderator:

•

Dr. Tan Chun Sheng
Group Vice President & General Manager Muar, STMicroelectronics

Panelists:

•

Dr. Yik Yee Tan
Senior Technology & Market Analyst, Semiconductor Packaging, YOLE Group

•

Dr. Eu Poh Leng
Senior Director of External Package Innovation, Package Innovation, Chief Technology Office, NXP Semiconductor

•

Ooi Teng Chow
ASr Director, Advanced Packaging Program Office, Intel.

•

Lee Chee Ping
Senior Director, Technologist & Technical Marketing, Lam Research

1:00 PM

Adjourn

Meet The Speakers

NATIONAL E&E FORUM 2024

Semiconductor As A Catalyst For The Malaysia Economy

Monday, 25 November 2024,

Hilton Kuala Lumpur,

Sentral Ballroom A & B

Program

Highlights video

Gold Sponsor

Silver Sponsor

Bronze Sponsors