Ooi Teng Chow

Sr Director, Advanced Packaging Program Office

Teng Chow joined Intel Disaggregation Manufacturing Operations in 2021 as the Senior Director of the Program Office. In his role, his is responsible for overlooking the start-up of the Advanced Packaging Factory from design review, hiring, supplier readiness, technology transfer to factory operations. As an industry veteran, Teng Chow has more than 20 years of various experience including FPGA and ASIC IC design, lead Product Test Development engineering and lead automotive qualification for generations of FPGA products. Teng Chow holds a bachelor’s degree on EE engineering from University of Technology Malaysia.