Dr. Eu Poh Leng

Senior Director of External Package Innovation, Package Innovation, Chief Technology Office

Dr. Eu Poh Leng has been with Motorola/Freescale/NXP Semiconductors Malaysia for 27 years and has been very actively involved in the development and introduction of new technology and new product in internal and external factories. She currently leads a team of engineers and site managers, who drive all NTI/NPI development of NXP products with various OSATs around the globe. She has published 74 technical papers and 4 journals externally and owns 24 filed and 11 issued patents. She is recognized as one of the Notable Inventors in NXP. Dr. Eu is also Chair of IEEE-EPS for Malaysia Chapter from Y2023-2024, and the recipient of IEEE Malaysia Women in Engineering Award on July 6th, 2024. Dr. Eu has 27 years in semiconductor industry and published 74 technical papers and 4 journals. She owns 23 filed and 11 issued patents.