Inv. Ts. Cheah Bok Eng

Organizing Chair

Inv. Ts. Cheah Bok Eng is a senior staff engineer from Intel Microelectronics. He is responsible for the platform electrical development works of memory IP designs for client and 5G networking applications. He has more than 40 technical publications and 190+ issued patents in the technical subject of signal integrity, advanced packaging, and system form-factor solutions. Bok Eng is a 5-time recipient of the prestigious Intel Top Inventor Awards. He was also recognized by the Malaysia Book of Records (MBR) in 2022 as the Inventor with the Most Worldwide Patent Grants. He is a senior member of IEEE (SMIEEE), an EXCO member of the Malaysia TRIZ Innovation Association (MyTRIZ) and the Malaysian Invention and Design Society (MINDS). He is also the author of a book titled “Innovation Unleashed… a 10-day journey with an inventor”. His unwavering dedication in promoting innovation has impacted more than 4,000 students and professionals at both national and international levels.