Dr Eu Poh Leng

Senior Director of Package Innovation, NXP Semiconductors

Dr Eu Poh Leng has 29 years of experience in Semiconductor Packaging, from Motorola to Freescale to NXP Semiconductors. She is experienced in both Conventional and Advanced Packaging including Panel Level Packaging. Since 2019, she leads a global team to develop, qualify and launch new products across 18 OSATs. She has published 88 technical papers and filed 28 patents. She has also held various leadership roles, including Exco of MSIA Aurum, IEEE Region 10 and IEEE Malaysia, as well as ex-chair of the IEEE Electronics Packaging Society. She is also an ex-winner of the IEEE Women In Engineering Award, among many other achievements.